Full Stack thermal engineering — from chip to system: design, simulation, prototyping, staffing, and training.
Architecture definition and optimization for air and liquid cooling — single‑phase, two‑phase, hybrid, immersion; active & passive — tailored to performance, cost, reliability, footprint, and compliance.
System‑level 1‑D models and high‑fidelity CFD with Digital Twins of advanced IC packages and entire data centers.
Large facility for rapid prototyping, instrumentation, and reliability testing.
● DoE, custom test rigs, load boards, DAQ
● Airflow/impedance, IR thermography, PWM/fan control● Thermal cycling and one-/two-phase immersion test loops
● Shock & vibration testing
Focused workshops for product teams, operators, and site EHS teams.