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Services

End-to-end thermal engineering — from chip to system: design, simulation, prototyping, staffing, and training.

Design

Architecture definition and optimization for air and liquid cooling — single‑phase, two‑phase, hybrid, immersion; active & passive — tailored to performance, cost, reliability, footprint, and compliance.

  • Micro-channel cold plate design and optimization
  • Immersion cooling of servers
  • Airflow optimization & acoustic targets
  • PCB layout design guidance
  • DFM/DFC/DFR reviews and thermal throttling policy design

Simulation

System‑level 1‑D models and high‑fidelity CFD with Digital Twins of advanced IC packages and entire data centers.

  • High‑fidelity multiphase transient modeling
  • System‑level analysis of nonlinear interactions among components
  • AI/ML surrogate (ROM) models & virtual temperature sensors
  • Thermal package characterization (Delphi, 2R) and stress/warpage studies
  • Reliability predictions: solder fatigue, crack initiation/propagation.

Prototyping & Testing

Large facility for rapid prototyping, instrumentation, and reliability testing.

● DoE, custom test rigs, load boards, DAQ
● Airflow/impedance, IR thermography, PWM/fan control● Thermal cycling and one-/two-phase immersion test loops
● Shock & vibration testing

Training

Focused workshops for product teams, operators, and site EHS teams.

  • Engineering modules: air vs. liquid cooling; single-/two‑phase fundamentals; 1‑D & CFD workflows; Digital Twin basics; throttling policy.
  • EHS & SOP curriculum: coolant handling & chemistry control; storage/transfer/containment; waste & spill response; electrical & fire safety; environmental controls; routine inspection & preventive maintenance.
  • Regulatory & compliance: Cal/OSHA, EPA, NFPA, ISO 9001/14001 mapping; audit checklist; site readiness.

Design

Architecture definition and optimization for air and liquid cooling — single‑phase, two‑phase, hybrid, immersion; active & passive — tailored to performance, cost, reliability, footprint, and compliance.

  • Micro-channel cold plate design and optimization
  • Immersion cooling of servers
  • Airflow optimization & acoustic targets
  • PCB layout design guidance
  • DFM/DFC/DFR reviews and thermal throttling policy design

Simulation

System‑level 1‑D models and high‑fidelity CFD with Digital Twins of advanced IC packages and entire data centers.

  • High‑fidelity multiphase transient modeling
  • System‑level analysis of nonlinear interactions among components
  • AI/ML surrogate (ROM) models & virtual temperature sensors
  • Thermal package characterization (Delphi, 2R) and stress/warpage studies
  • Reliability predictions: solder fatigue, crack initiation/propagation.

Prototyping & Testing

Large facility for rapid prototyping, instrumentation, and reliability testing.

● DoE, custom test rigs, load boards, DAQ
● Airflow/impedance, IR thermography, PWM/fan control● Thermal cycling and one-/two-phase immersion test loops
● Shock & vibration testing

Training

Focused workshops for product teams, operators, and site EHS teams.

  • Engineering modules: air vs. liquid cooling; single-/two‑phase fundamentals; 1‑D & CFD workflows; Digital Twin basics; throttling policy.
  • EHS & SOP curriculum: coolant handling & chemistry control; storage/transfer/containment; waste & spill response; electrical & fire safety; environmental controls; routine inspection & preventive maintenance.
  • Regulatory & compliance: Cal/OSHA, EPA, NFPA, ISO 9001/14001 mapping; audit checklist; site readiness.

Staffing

Specialized thermal talent — embedded on your team or delivered as a pod. IP‑safe workflows, secure toolchains, and clear deliverables.

Typical Roles

  • Thermal Architect: liquid/air systems, cold plates, two‑phase/immersion, throttling policy
  • CFD Engineer: Icepak, Fluent, Flotherm, FloEFD, Ansys Mechanical; conjugate heat transfer
  • System‑Level Modeler: 1‑D networks, control co‑sim (Twin Builder), ROMs
  • CAD Designer: NX, CATIA, SolidWorks; 3D layouts & assemblies, drawings & GD&T, ECO support
  • Test Engineer: construct test vehicles, design DOE, execute tests, prepare reports
  • Program Manager: cross‑functional delivery, risk & compliance tracking
  •  

Typical Durations

  • Project sprints: 4–12 weeks for scoped outcomes
  • Team augmentation: 3–6 months with weekly KPIs
  • Roadmap partnership: 6–18 months, shared metrics & reviews

Why HeatSync Talent

Architecture definition and optimization for air and liquid cooling — single‑phase, two‑phase, hybrid, immersion; active & passive — tailored to performance, cost, reliability, footprint, and compliance.

  • Micro-channel cold plate design and optimization
  • Immersion cooling of servers
  • Airflow optimization & acoustic targets
  • PCB layout design guidance
  • DFM/DFC/DFR reviews and thermal throttling policy design

 
Representative outcomes (anonymized): −18°C hotspot reduction on AI accelerator; 12% BOM cost reduction via heatsink redesign; −3 dBA acoustic improvement.